A transparent conductive film wherein the height number distribution of projections present on the surface is expressed by a distribution function of .chi..sup.2 type having a degree of freedom of 3.5 to 15 when the unit of the horizontal axis is a nanometer, the height/width ratio number distribution is expressed by a distribution function of .chi..sup.2 type having a degree of freedom of 10-35.chi..sup.2, the projections having a height of 50-350 nm account for 70% of more, and the projections having a height/width ratio of 0.25-1.02 account for 90% or more.