Methods are provided for creating lined vias in semiconductor substrates.
Using electrophoretic deposition techniques, micelles of a lining
material are deposited on the wall of the via, reacting with the surface
of the wall until the entire wall is covered by the lining material. The
lining material is then fixed in place to form a layer lining the via.
The lined via may then be filled with a desired material. For example, a
via lined with an insulative material may be filled with a material such
as copper to create an insulated conductive via through the substrate.