The present invention relates to a thick film composition comprising: a) functional component; b) PVDF/HFP polymer resin, a copolymer of PVDF/HFP polymer resin, or mixtures thereof; dissolved in c) organic solvent, with the provisos that the PVDF/HFP resin has i) a melt viscosity of 0.2-0.7 kPoise and ii) a DSC melt temperature in the range of 85-98.degree. C.

 
Web www.patentalert.com

< Water dispersible polydioxythiophenes with polymeric acid colloids and a water-miscible organic liquid

> Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto
~ 00415