In apparatus for mechanically bonding and cutting an article during assembly thereof at least a portion of the article is transported through a nip defined by first and second members. A bonding segment is disposed on one of the first and second members and a cutting segment separate from the bonding segment is also disposed on one of the first and second members. The apparatus is operable so that a portion of the article is mechanically bonded as the article passes through the nip and a portion of the article separate from the bonded portion is cut as the article passes through the nip.