A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe and baffles attached to the pipe, where one end of the pipe is connected to one end of the tubing. A pump, connected to the other ends of the tubing and pipe, circulates coolant through the pipe and tubing to transfer thermal energy from the metal block to the radiator. The mechanism also includes a fan unit to generate and direct an air flow toward the radiator and metal block, where the air flow removes the thermal energy from the radiator and metal block.