Shock-absorbing member 18, a shock-absorbing method and an electronic device employing the member are disclosed, wherein the shock-absorbing member prevents electronic equipment main body from receiving a large shock and avoids a fatal damage to the equipment, even when the equipment is subjected to substantially a large impact of dropping of the equipment for instance. More specifically, shock absorbing member 18 is formed by integrally molding shock-absorbing base part 18a of resin material having a flexibility but having a certain degree of hardness and formed into a thin plate, and highly soft shock-absorbing base part 18a having a cushion capability, into a unit having a certain degree of thickness, wherein shock-absorbing base part 18a is thinner than shock-absorbing flexible part 18b, wherein shock-absorbing base part 18a bends when receiving an impact, and start absorbing the shock by buckling at a bending part thereof. Shock-absorbing member 18 is disposed on and fixed to electronic equipment main body, constituting the invention.