A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which includes a conductive copper termination. The copper termination is made by firing an ink including a glass component, which may include ZnO, provided the amount does not exceed about 65 mole %; B.sub.2O.sub.3, provided the amount does not exceed about 61 mole %; and, SiO.sub.2, provided the amount does not exceed about 63 mole %. The molar ratio of B.sub.2O.sub.3 to SiO.sub.2 is from about 0.05 to about 3.