A method of forming a magnetic assembly having at least one magnetic layer having dimensions of thickness, width and length, and at least one printable substrate layer having dimensions of thickness, width and length, including the steps of providing a molten magnetic composition including about 70 wt-% to about 95 wt-% of at least one magnetic material and about 5 wt-% to about 30 wt-% of at least one thermoplastic binder, forming the magnetic composition into a magnetic layer at an elevated temperature and directly applying the magnetic layer at an elevated temperature to a first surface of a printable substrate layer wherein. An adhesion promoting composition may be further provided between the magnetic layer and the printable substrate layer for improving adhesion between the magnetic layer and the printable substrate layer.