To provide a component built-in wiring board and a manufacturing method
thereof capable of further improving component mounting density without
deteriorating reliability. The component built-in wiring board includes:
a conductive layer (34, 35) extending in a thickness direction of the
board and buried in the board without being exposed from an upper and a
lower surface of the board; an electrical/electronic component (33)
having a terminal and buried in the board with the terminal facing the
buried conductive layer; a connecting member (36, 37) provided in a gap
between the terminal of the buried electrical/electronic component and
the conductive layer to electrically/mechanically connect the terminal
and the conductive layer; and two upper and lower insulating layers (11,
15) which cover an outer surface of the buried electrical/electronic
component excluding a portion connected to the connecting member and
which are in close contact with a top and a bottom in the board thickness
direction of the electrical/electronic component.