An article of manufacture and apparatus are provided for processing a
substrate surface. In one aspect, an article of manufacture is provided
for polishing a substrate including polishing article comprising a body
having at least a partially conductive polishing surface. An electrode is
disposed below the polishing surface having a dielectric material
therebetween. A plurality of apertures may be formed in the polishing
surface and the dielectric material to at least partially expose the
electrode to the polishing surface. A membrane may be disposed between
the electrode and the polishing surface that is permeable to ions and
current to promote continuity between the electrode and the polishing
surface.