A cluster tool is provided for the implementing of a clustered and integrated surface pre-cleaning of the surface of semiconductor devices. More particularly, there is provided a cluster tool and a method of utilization thereof in an integrated semiconductor device surface pre-cleaning, which is directed towards a manufacturing aspect in which a chamber for performing a dry processing chemical oxide removal (COR) on the semiconductor device surface is clustered with other tools, such as a metal deposition tool for silicide or contact formation, including the provision of a vacuum transfer module in the cluster tool.