A method of manufacturing a substrate for a circuit board includes forming
a groove having a predetermined shape and pattern in at least one surface
of a substrate formed of an insulating material, filling the groove with
a conductive material, and forming a circuit pattern by hardening the
conductive material filling the groove. The groove is preferably formed
by impression with a die containing a pattern corresponding to the shape
and pattern of the groove. A substrate and a smart label formed of the
substrate are also disclosed.