A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a wedgelock used in conjunction with the rod that can be attached to the rod. The guide device can be used in an electronic assembly comprising a chassis having at least one slot, and at least one printed wiring assembly with a printed wiring board disposed in the slot. At least one integrated circuit package is electrically attached to the printed wiring board. The printed wiring board provides a thermal path to the chassis. The guide device provides one or more additional thermal paths between the printed wiring board and the chassis.