A semiconductor-containing flexible skin suitable for use in intelligent textile applications includes a metal layer, an insulating layer, and one or more semiconductor islands sandwiched between a first flexible polymer layer and a second flexible polymer layer. Various electronics and sensors can be advantageously incorporated on the semiconductor islands. The metal layer of the invention is patterned into conducting paths that allow electrical communication between the semiconductor islands and to any devices connected to flexible skin. Moreover, the insulating layer is disposed between the metal layer and semiconductor islands. An intelligent textile includes the semiconductor-containing flexible skin attached to a fabric. Specifically, opening in the flexible textile allow direct weaving with textiles. A method of forming the flexible skin and intelligent fabric is also provided.