Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.

 
Web www.patentalert.com

< Assembly and heat-dissipating device having the same assembly

> Liquid-cooled heat dissipation module

~ 00422