A family of alloys for use in medical, electrical contact and jewelry
applications includes as primary components palladium, and boron and at
least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten,
cobalt, nickel, tantalum and iridium. An alternative embodiment includes
palladium and rhenium and/or ruthenium with an additional element
iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and
tantalum. The present alloy family has a high strength, high radio
opacity, and biocompatibility characteristics, while also being workable
into various configurations. Where required, some of the alloys also
offer post form, heat treatment (age hardening) capabilities for even
higher hardness and strength levels.