A circuit assembly for mounting one or more integrated circuits that
effectively dissipates heat generated by the integrated circuits, and a
corresponding method for fabricating such a circuit assembly. The circuit
assembly comprises a substrate, a thermally-conductive adhesive layer and
a heat-dissipating layer. The substrate includes an opening extending
between a first surface and a second surface of the substrate. An
integrated circuit is to be mounted on the first surface of the substrate
substantially coincident with the opening. The thermally-conductive
adhesive layer is at least partially disposed within the opening in the
substrate. The heat-dissipating layer is disposed on the second surface
of the substrate and includes a raised portion that at least partially
extends through the opening in the substrate.