An object is to provide a light emitting device capable of efficiently
dissipating heat generated in a semiconductor light-emitting element. The
light emitting device 1 for achieving this object is a device wherein a
multilayer chip varistor 10 has a varistor element 11 having a varistor
layer comprised essentially of ZnO, and a plurality of internal
electrodes 101, 102 arranged to sandwich the varistor layer between the
internal electrodes; and a plurality of external electrodes 103, 104
formed on an outer surface of the varistor element 11 and each connected
to a corresponding internal electrode 101, 102; wherein a semiconductor
light-emitting element 20 has an electroconductive substrate 202 of ZnO,
and semiconductor layers 201, 203, 205 of ZnO formed by epitaxial growth
on two surfaces of the electroconductive substrate 202; wherein the
semiconductor light-emitting element 20 is placed on a principal surface
11a intersecting with the internal electrodes 101, 102 of the multilayer
chip varistor 10; wherein the semiconductor layer 205 is fixed in face
contact to the principal surface 11a.