Disclosed are an image sensor package and a method for manufacturing the
same. A sealing portion is formed between an image sensor die and a glass
substrate to completely isolate the sensing portion of the image sensor
die from external environment. Electrically conductive bumps are formed
outside of the sealing portion to electrically connect the image sensor
die to the glass substrate. The image sensor die can be sealed by a cap
while the image sensor die is connected to the glass substrate via the
electrically conductive bumps.