A highly reliable electrical device having a multilayered structure of a plurality of thin-film device layers and a method for manufacturing the same are provided. An electrical device includes a plurality of thin-film layers deposited and including a plurality of thin-film device layers each having a semiconductor device, and conductive layers with a predetermined thermal conductivity provided between adjacent thin-film layers. Examples of materials for the conductive layers include metals, metal compounds, resins with a metal or metal compound dispersed, and electrically conductive polymers.