An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer. In a method of cooling a microprocessor including a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid, the method includes disposing at least one configurable diamond pin at a hot spot location of the microprocessor; and configuring a heat sink structure and at least one heat pipe atop the second thermal interface material layer.