A surface acoustic wave (SAW) device package and method for packaging a
SAW device provide a surface excited device having a small footprint, low
cost and streamlined manufacturing process. A substrate including a SAW
active area on a first side is interconnected to external circuits and
mechanically mounted via a plurality of metal pillars and an outer metal
sealing wall. The sealing wall additionally provides protection from
external environmental contamination and interference. The sealing wall
may include a number of gaps to reduce stress due to differences in
thermal expansion coefficients between the SAW substrate and the metal
sealing wall and the gaps may be filled with a flexible sealant. The
metal pillars may be round, square or other suitable shape and solder
bump terminals may be added to the ends of the pillars and the bottom
edge of the sealing wall.