A semiconductor package assembly is presented. The assembly comprises a
first chip and a second chip. The back surfaces of the first and the
second chips are thermally attached through a die attach material. The
front surface of the first chip is attached to a substrate through bumps.
A heat spreader extends from a surface of the semiconductor package
assembly into the semiconductor package assembly and thermally attaches
to the back surface of the first chip or the front surface of the second
chip. Depending on the sizes of the chips and the location of the bonding
pads, the heat spreader may be attached to the back surface of the first
chip or the front surface of the second chip.