Disclosed is an adhesive agent which is curable and has flexibility at low
temperature, and further has resistant to solvent type ink. The adhesive
agent includes a base and an activator, wherein the base includes at
least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound
mixed with an epoxy compound having three or more epoxy groups; and
bisphenol A epoxy compound mixed with an epoxy compound having three or
more epoxy groups, wherein the activator includes: 100 parts by mass of
polyamide composed of a condensation reaction product of C36 unsaturated
fatty acid dimer and polyamine; and 5 to 200 parts by mass of alicyclic
polyamine, and wherein the base is mixed with the activator with a ratio
of 10 to 200 parts by mass of the activator with respect to 100 parts by
mass of the base.