An interconnect that may reduce a head slider's exposure to electrostatic discharge events and may dissipate charging of the head is provided. Conductive and nonconductive adhesives are used to adhere a head slider to the interconnect. An electromagnetic interference generating circuit generates current that flows through the conductive adhesive bonding the head slider to the flexure arm. The electromagnetic interference current breaks down the resistance of the conductive adhesive to dissipate an electrostatic voltage charge on the head slider. This may prolong the life of the head slider and a read/write head coupled to the head slider.