A conductive paste for a terminal electrode of a multilayer ceramic
electronic part, comprising (A) a spherical conductive powder which
comprises chiefly copper, and which has a vitreous thin film on at least
a portion of the surfaces thereof, (B) a flaky conductive powder
comprising chiefly copper, (C) a glass powder, and (D) an organic
vehicle, and may further contain (E) an aliphatic amine. When baked to
form terminal electrodes for multilayer ceramic electronic parts, this
paste exhibits extremely superior binder removal characteristics at low
temperatures, and furthermore, it is superior in terms of oxidation
resistance, binder removal characteristics and firing characteristics
with no need for strict control of the firing conditions, thereby dense
terminal electrodes that are superior in terms of adhesion and
conductivity can be formed.