The invention is an imager assembly for a miniature camera head. The
assembly comprises an imaging sensor having conductive leads; an
objective lens system placed on top of the sensor; circuitry, mounted
beneath the imaging sensor, for driving the sensor and amplifying the
electrical signals; and conductive wires electrically linking the
internal components of the assembly and for linking the assembly to
remote locations. The conductive leads are bent and the circuitry and
conductive wires are arranged and mounted such that the dimensions in a
plane parallel to the sensor plane of the camera head are approximately
equal to or less than the dimensions in the plane of the sensor. The
circuitry is capable of delivering signals produced by the imaging sensor
for further processing and the components of the imager, except for the
imaging surface of the sensor and the objective lens system, are
encapsulated by an isolating material.