A plasma display device for efficiently dissipating heat from a driver IC packaged in a form of a tape carrier package. The device includes a plasma display panel, a printed circuit board assembly, a chassis base having one surface attached to the plasma display panel and another surface adapted to mount the printed circuit board assembly thereon, a TCP (tape carrier package) adapted to electrically connect the printed circuit board assembly to an electrode leading out from the plasma display panel, a driver IC (integrated circuit) arranged on the TCP, the driver IC being adapted to generate and selectively apply a pulse to the electrode leading out from the plasma display panel, a chassis bed arranged at an edge of the chassis base, the chassis bed being adapted to support one side of the driver IC on the TCP, a cover plate adapted to cover another side of the driver IC on the TCP, the cover plate being further adapted to be opposingly arranged at the chassis bed and a heat sink arranged at an outer surface of the cover plate and arranged lengthwise with the cover plate, the heat sink comprising vertical and horizontal air passages.