A method of manufacturing a wiring board is disclosed. The wiring board has: a capacitor, having multiple electrode layers which oppose each other with a dielectric layer in between, that is connected to a semiconductor chip; one or more via wirings which pierce the electrode layers and which are connected to the semiconductor chip, and pattern wirings connected to the via wirings. The method includes: forming the electrode layers, each having one or more through holes which the via wirings pierce, and the dielectric layer, and forming the capacitor; installing the capacitor such that the capacitor opposes the pattern wirings over an insulating layer; forming one or more via holes which reach the pattern wirings from the through holes; and forming the via wiring in the via hole.