In accordance with the present invention, we have developed compositions useful for the preparation of prepregs, laminates, and the like having excellent performance properties. Invention compositions comprise a combination of a first component (i.e., a low loss, low dielectric constant, hydrocarbyl thermoplastic resin), a second component (i.e., a component which is capable of crosslinking to produce a thermoset in the presence of the first component), a free radical source, and optionally, one or more additives and/or diluents. Invention compositions can be prepared from widely available and inexpensive starting materials. As a result, invention compositions not only provide fabricated articles having outstanding performance properties, in addition, the cost of producing the resulting articles compares quite favorably with the cost of making competitive materials which require the use of more expensive, less readily available starting materials. Also provided in accordance with the present invention are prepregs prepared from invention compositions, laminated sheets prepared from the above-described prepregs, printed wiring boards, methods of making each of the above, and the like.