A method and apparatus for dechucking a substrate is provided. In one
embodiment, a processing chamber is provided that includes a grounded
chamber body having a substrate support assembly disposed in an interior
volume. A dechucking circuit selectively couples the substrate support
assembly to ground or to a power source. In another embodiment of the
invention, a method for dechucking a substrate includes the steps of
completing a plasma process on a substrate disposed on a grounded
substrate support assembly, disconnecting the substrate support assembly
from ground, and applying a dechucking voltage to the substrate support
assembly.