The enclosed electronic ballast housing provides improved convection heat transfer for lowering the ambient housing temperature for keeping the junction temperature of power semiconductors inside the enclosed electronic ballast housing within certain specified temperature ranges for long-term reliable operation. The enclosed electronic ballast housing includes at least one folded fin on at least one of the enclosed electronic ballast housing surfaces, the folded fin may be manufactured from the same piece of material as the ballast housing for improved heat transfer. The folded fins are substantially parallel to their respective adjacent surfaces. Additionally, the enclosed electronic ballast housing includes separating portions of heat dissipating sections of ballast circuitry outside of the housing ballast.