A solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus including a jet head for ejecting a droplet of a solution containing fine particles onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, wherein the substrate has no liquid absorbing property, wherein the jet head includes a nozzle from which the droplet is ejected, the nozzle being formed from a material that has a greater hardness than that of the fine particles in the solution, wherein the nozzle has a size that is equal to or less than .PHI.20 .mu.m, the nozzle satisfying a relation of 0.0001.ltoreq.Dp/Do.ltoreq.0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, wherein each of the fine particles has a size that is equal to or less than the roughness of a surface of the substrate.