In a substrate-processing method including a step of forming a liquid immersion area of a liquid on a substrate and performing exposure for the substrate by irradiating an exposure light beam onto the substrate through the liquid in the liquid immersion area, a liquid contact time, during which the substrate is in contact with the liquid in the liquid immersion area, is managed. Accordingly, in a device producing process, it is possible to suppress the occurrence of device defect.

 
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