A thermoplastic composition that includes a base polymer, a fluoropolymer, and a fluoride scavenger having suitable fluoride levels such that use in the electronics industry is appropriate. An extrusion method may be used for making the thermoplastic composition. The compositions may then be used to form a molded article. The composition has lower fluoride levels as compared to thermoplastic compositions without the fluoride scavenger making it suitable for use in electronic applications, as well as medical or food or beverage applications where fluoride ions are a concern.