A modular light emitting diode (LED) mounting configuration is provided including a light source module having at least one LED. The module includes a heat conductive body portion adapted to conduct heat generated by the LED away from the LED. As a result, the LED can be operated with a higher current than normally allowed. Thus, LED brightness and performance is increased without decreasing life expectancy. An adhesive connects the LED module to the mount surface. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.