An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.