A method for dicing a sheet workpiece includes the following steps. A base (10) is provided. A water-soluble adhesive (20) is coated onto the base, and the workpiece is placed on the water-soluble adhesive. The water-soluble adhesive is hardened so as to, fix the workpiece on the base. The workpiece is diced to form cut pieces. The hardened water-soluble adhesive dissolves in water. The present method reduces the deformation of the hardened water-soluble adhesive and may thus eliminate chipping. Accordingly, the present method can contribute significantly to improving the production yield.

 
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> Method and apparatus for avoiding dicing chip-outs in integrated circuit die

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