A process for joining substrates having electrical, semiconducting,
mechanical and/or optical components, and to a composite element is
provided. The process is to be suitable for substrates that are to be
joined substantially irrespective of material and for sensitive
substrates. According to the process, a raised frame, in particular
formed from anodically bondable glass, is applied by evaporation coating
to one of the two substrates in order to serve as a joining element.