A microelectronic switch having a substrate layer, an electrically
conductive switching layer formed on the substrate layer, an electrically
conductive cavity layer formed on the switching layer, an electrically
conductive cap layer formed on the cavity layer, the cap layer forming a
first electrode and a second electrode that are physically and
electrically separated one from another, and which both at least
partially overlie the switching layer, and a cavity disposed between the
switching layer and the second electrode, where the switching is layer is
flexible to make electrical contact with the second electrode by flexing
through the cavity upon selective application of an electrical bias.