An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a heat sink having first and second ends. The heat sink is configured to interface with the mounting plate in order to provide a downward force on the heat producing circuit board component. The apparatus also includes at least one bellows device coupling a heat transfer tip with the first end of the heat sink, wherein the bellows device is configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component. The system includes a circuit board, a plurality of heat producing circuit board components, and the described apparatus.