An electronic apparatus has a housing which is formed with a suction port and an exhaust port. The interior of the housing is partitioned with a first chamber and a second chamber by a partition wall. The first chamber accommodates a CPU generating heat. The suction port and the exhaust port are open to the second chamber. A heat pipe which transfers a heat of the CPU from the first chamber to the second chamber is disposed pass through the partition wall. A fan is disposed in the second chamber. The fan suctions air from the suction ports and discharges the suctioned air from the exhaust port. The heat of the CPU transferred to the second chamber is emitted out of the housing. A part where the heat pipe pass through the partition wall is liquid-tightly sealed through a sealing member.

 
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> System and method for cooling electronic devices

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