This invention relates to novel compositions comprising a protective polymer layer and a UV blocking agent. This is used in the fabrication of electronic devices using thick film pastes. The present invention is also an electronic device fabrication process using the compositions. The protective polymer layer is fabricated from materials, which are insoluble after irradiation in the ester-type solvents contained in the thick film paste. By appropriate selection of protective film polymers, the protective film can be compatible with the thick film paste and can be further used to shield portions of the thick film paste from UV irradiation.