Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit pattern and a solder ball pad pattern is formed, an insulating layer formed between the first and second external layers, a first outer via hole to electrically connect the first and second external layers to each other, and a solder resist layer formed on each of the first and second external layers, with portions of the solder resist layer corresponding to the wire bonding pad pattern and the solder ball pad pattern being opened. The solder ball pad pattern is thinner than the circuit pattern of the second external layer.