A structure for mounting an electronic component on a wiring board according to the invention includes a wiring board that is provided with wiring patterns, each having a land portion, and an electronic component that has a plurality of electrodes which are soldered to the land portions. Each land portion is made of a first metallic material which is solderable. Further, on each wiring pattern adjacent to each land portion, a second metallic material which is nonsolderable is provided.

 
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~ 00452