An encapsulated electronic part packaging structure includes a step of mounting an electronic part having a connection terminal and a passivating film to cover the connection terminal, mounted on a body to direct the connection terminal upward. An insulating layer is formed to cover the electronic part, and a via hole is formed in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal. A wiring pattern, which is connected electrically to the connection terminal via the via hole, is formed on the insulating layer.