A vacuum micropump for use in a sealed package includes at least one pumping cell and a magnetic field proximate to the pumping cell. The pumping cell has at least one anode, at least one dielectric in contact with the at least one anode, at least one titanium cathode in contact with the dielectric and an electric field between the at least one anode and the at least one cathode. The dielectric defines a space between the at least one anode and the at least one cathode. The vacuum micropump may be used to gauge pressure within the sealed package. An appropriate method of use is also provided.