An enclosure with integral snap-acting mounting feet for mounting a unit, such as a sensor, to a DIN rail. The unit includes a component portion and a mounting portion. The component portion is the sensor or other apparatus. The mounting portion is integrally formed to the component portion through a flexible hinge portion. The mounting portion includes a tab formed on either side of the mounting portion, and a mounting foot integrally formed to each tab. The flexible hinge portion allows the operator to easily snap the unit onto a DIN rail. The unit is then removed from the DIN rail by pulling on either of the tabs, which causes the hinge portion to flex and allows the mounting foot to be disengaged from the DIN rail.