The stack type package module includes a plurality of stacked tape carrier packages. Each package has an elongated lead having an extension end connected to the first lateral end connected to a central portion connected to a second lateral end. The second lateral end is connected to the respective chip via a bump. The packages made as such are then stacked on top of each other on a printed circuit board. The plurality of the stacked first lateral ends are then cut and soldered the printed circuit board. The predetermined portions of the packages including the cut first lateral ends are sealed for protection.