A method is provided for modifying a circuit containing a plurality of electrodes, within a substrate, comprising the steps of: (a) selecting at least two electrodes for making a connection; (b) removing materials covering the electrodes with a focused ion beam (FIB) or a laser to form contact holes for respectively exposing the electrodes; (c) depositing in the contact holes a conductive material for forming electrically conductive piers, by applying the focused ion beam (FIB) or laser, with gas molecules ejected from a nozzle; (d) disposing an electrically conductive viscid material over each of the electrically conductive piers; and (e) disposing an electrically conductive bridge floor to connect with the electrically conductive viscid material to form an electrically conductive bridge.